3/31/2021 0 Comments Datacon Die Bonder
Our PCBA testing facility is open for board testing and we offer remote support of all equipment under contract.Essential site visits can be carried out in keeping with the guidelines.
![]() Beside the factory-proven QUANTUM values it provides superior speed and accuracy while drastically improving your cost-of-ownership. Thermo Compression bonding is the key technology for current 2.5D3D C2S and C2W packaging, with TC-CUF as the currently established process for 3D memory applications.The Datacon 8800 TC advanced sets the new benchmark based on the proven 8800 concept with total process control, advanced capabilities and unsurpassed production stability. With its unique and completely new Advanced Hardware architecture, unique 7-Axis Bond head and Advanced Process capabilities, the Datacon 8800 TC advanced is the essential tool of reference of current TSV applications. Ultra Fine Pitch Capability Enhanced Thermo Compression Bond Control 7-Axis Bond Head Highest Productivity on Smallest Footprint. As mass reflow Flip Chip becomes dominant in IC packaging, Besi again sets the benchmark for speed and productivity with its new Datacon 8800 FC QUANTUM advanced. The state of the art motion control, unique CRYSTAL - glass based fluxer - concept and enhanced computing power showcases the fastest and most cost effective Flip Chip system available today. Datacon Die Bonder Full Process ControlHighest UPH up to 9000, including dip fluxing Full process and yield control Proven 5 m accuracy - Unprecedented Speed Unique patent pending CRYSTAL concept (glass based fluxer with simultaneous inspection) Enhanced trajectories and motion control Highest speed with full process control Full Yield Control Full Process Production control Superior usability with enhanced Pseudo X-Ray Fast Post Bond Inspection Proven Production Accuracy 5 m accuracy at highest speed Lowest vibration with SMART path filtering Enhanced Matrix BMC test. The Datacon 8800 FC QUANTUM sigma flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform. Beside the factory-proven QUANTUM values it provides superior speed and accuracy for Flip Chip applications, whilst drastically improving your cost-of-ownership. Highest Productivity for FO-WLPAs a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control.The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. Please complete and submit the form with you name, contact details and a brief description of your enquiry. A member of the Accelonix team will respond back to you as soon as possible.
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